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Tongfu Microelectronics Co., Ltd. Intelligent Power Chip Packaging and Testing Project Phase I Wall Panel Installation Project

Tongfu Microelectronics Co., Ltd. Intelligent Power Chip Packaging and Testing Project Phase I Wall Panel Installation Project

Tongfu Microelectronics Co., Ltd. Intelligent Power Chip Packaging and Testing Project Phase I Wall Panel Installation Project

工程描述

The first phase of the intelligent power chip packaging and testing project of Tongfu Microelectronics Co., Ltd. has a total construction area of ​​53,068.26 square meters, a parapet elevation of 17.1 meters, a roof elevation of 29.4 meters, and a two-story structure. The exterior wall enclosure is a subcontracted project with a construction volume of 12,306 square meters. The wall panels are all made of rock wool sandwich panels. Our company started installing the wall panels on November 1 last year.

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